METHOD AND DEVICE FOR PROCESSING COOLING HOLE ON WORKPIECE WITH LASER

Title:

METHOD AND DEVICE FOR PROCESSING COOLING HOLE ON WORKPIECE WITH LASER

Document Type and Number:

WIPO Patent Application WO/2016/074135

Kind Code:

A1

Abstract:

A method for processing a cooling hole on a workpiece with laser. The cooling hole (10) includes a shaped hole section (11). The method comprises the following steps: emitting a first laser pulse to a rough processing part in the position of the shaped hole section to be processed on the workpiece (20) according to the geometrical parameters of the shaped hole section so as to remove the material of the workpiece on the rough machining part (11A) and finish the rough processing of the shaped hole section; emitting a second laser pulse to the processing allowance part beyond the rough processing part of the shaped hole section to be processed according to the geometrical parameters of the shaped hole section so as to remove the material allowance of the workpiece on the processing allowance part (11B) and finish the finish processing of the shaped hole section. The energy of the first laser pulse is larger than that of the second laser pulse. Also disclosed are a device for processing a cooling hole on a workpiece with laser, a system for processing a cooling hole on a workpiece and a machine readable storage medium.

Inventors:

LI HONGTAO (CN)
BECK THOMAS (DE)

Application Number:

PCT/CN2014/090738

Publication Date:

May 19, 2016

Filing Date:

November 10, 2014

Export Citation:

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Assignee:

SIEMENS AG (DE)
LI HONGTAO (CN)
BECK THOMAS (DE)

International Classes:

B23K26/384

Foreign References:

CN101332559A	2008-12-31
CN103990910A	2014-08-20
CN104131900A	2014-11-05
CN1234310A	1999-11-10
CN101992352A	2011-03-30

Other References: