METHOD AND DEVICE FOR RADIOFREQUENCY IMPEDANCE MATCHING, AND SEMICONDUCTOR PROCESSING EQUIPMENT

WIPO Patent Application WO/2019/206135

A1

Disclosed are a method, a device, and equipment for radiofrequency impedance matching, comprising: S110, a frequency sweep matching phase; and S120, a frequency sweep holding phase. S110 comprises the loop execution of the following steps for at least once: S111, acquiring a frequency sweep termination parameter of a radiofrequency power supply when at least one predetermined pulse phase of a current pulse cycle is finished; S112, determining whether the frequency sweep termination parameters of the predetermined pulse phases of the current pulse cycle match a target frequency sweep parameter; executing S120 when a match is found and executing S113 when no match is found; S113, in predetermined pulse phases of the next pulse cycle, the radiofrequency power supply performs frequency sweeps respectively on the basis of the frequency sweep termination parameters of the predetermined pulse phases of the previous pulse cycle; and S120 comprising: in predetermined pulse phases of subsequent pulse cycles, the radiofrequency power supply stops frequency sweeping and holds the frequency sweep termination parameter matching the target frequency sweep parameter. This allows a quick frequency sweep for a match with the target frequency sweep parameter and effectively ensures that a pulsed plasma is ignited smoothly.

WEI GANG (CN)
WEI JING (CN)
YANG JING (CN)

PCT/CN2019/083882

October 31, 2019

April 23, 2019

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BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)

H01J37/32

CN103650645A	2014-03-19
CN107887247A	2018-04-06

TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)

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