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Title:
METHOD AND DEVICE FOR RECOVERING PUNCTURE REPAIR LIQUID
Document Type and Number:
WIPO Patent Application WO/2011/086764
Kind Code:
A1
Abstract:
Disclosed are a method and device for recovering puncture repair liquid, which have made it possible to efficiently perform the recovery operation of the puncture repair liquid without cutting out a tire valve. Specifically disclosed is a method for recovering puncture repair liquid, wherein with the use of a device for recovering the puncture repair liquid, which is provided with a tube having at least the length to reach the inner surface of a tire so as to be inserted from a tire valve mounted to a wheel to the inside of the tire, and a pipe member or a drainage device, which is connected between the tire valve and a pressurized air source, a valve core is detached from the tire valve of the wheel, into the tire of which the puncture repair liquid is injected, the tube is inserted into the tire via the tire valve, the pipe member or the drainage device is connected between the tire valve and the pressurized air source, the tire is filled with the air from the pressurized air source, and the puncture repair liquid in the tire is then recovered from the end section of the pipe member or the drainage port of the drainage device utilizing the action by which the pressure in the tire is lost.

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Inventors:
KANENARI,Daisuke (Hiratsuka Factory, 2-1, Oiwake, Hiratsuka-sh, Kanagawa 01, 〒2548601, JP)
金成 大輔 (〒01 神奈川県平塚市追分2番1号 横浜ゴム株式会社 平塚製造所内 Kanagawa, 〒2548601, JP)
OKAMATSU,Takahiro (Hiratsuka Factory, 2-1, Oiwake, Hiratsuka-sh, Kanagawa 01, 〒2548601, JP)
Application Number:
JP2010/070677
Publication Date:
July 21, 2011
Filing Date:
November 19, 2010
Export Citation:
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Assignee:
THE YOKOHAMA RUBBER CO.,LTD. (36-11, Shimbashi 5-chome Minato-k, Tokyo 85, 〒1058685, JP)
横浜ゴム株式会社 (〒85 東京都港区新橋5丁目36番11号 Tokyo, 〒1058685, JP)
KANENARI,Daisuke (Hiratsuka Factory, 2-1, Oiwake, Hiratsuka-sh, Kanagawa 01, 〒2548601, JP)
金成 大輔 (〒01 神奈川県平塚市追分2番1号 横浜ゴム株式会社 平塚製造所内 Kanagawa, 〒2548601, JP)
International Classes:
B29C73/02; B29C73/24
Foreign References:
JP2007331210A
JPH1067212A
JPH01266047A
JP2009090574A
JP2005138400A
Attorney, Agent or Firm:
OGAWA,Shin-ichi et al. (Seiryu International Patent Office, 37 Kowa Building 4-5, Tsukiji 1-chome, Chuo-k, Tokyo 45, 〒1040045, JP)
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Claims: