Title:
METHOD AND DEVICE FOR REMOVAL OF THIN-FILM
Document Type and Number:
WIPO Patent Application WO/2004/007137
Kind Code:
A1
Abstract:
A method of removing a thin-film (11) from the surface of a substrate (12) by radiating laser beam (13) onto the surface of the substrate (12) coated with the thin-film (11), comprising the step of radiating the laser beam (13) aslant onto the surface of the substrate (12).
Inventors:
FUKUDA NAOAKI
KITAGAWA AKIKAZU
KATO TSUYOSHI
YAMADA MINORU
TAKEI KENJI
TANIMOTO YASUNORI
UKAI YASUHIRO
MUNAKATA MASAKI
KITAGAWA AKIKAZU
KATO TSUYOSHI
YAMADA MINORU
TAKEI KENJI
TANIMOTO YASUNORI
UKAI YASUHIRO
MUNAKATA MASAKI
Application Number:
PCT/JP2003/008749
Publication Date:
January 22, 2004
Filing Date:
July 10, 2003
Export Citation:
Assignee:
HITACHI SHIPBUILDING ENG CO (JP)
TAKEI ELECTRIC IND CO LTD (JP)
SONY CORP (JP)
TAKEI ELECTRIC IND CO LTD (JP)
SONY CORP (JP)
International Classes:
B23K26/351; B23K26/042; B23K26/067; B23K26/36; B23K26/361; H01S3/00; (IPC1-7): B23K26/36
Foreign References:
| JPH11170072A | 1999-06-29 | |||
| JP2000323027A | 2000-11-24 | |||
| JPH11277279A | 1999-10-12 | |||
| JPH08197271A | 1996-08-06 |
Attorney, Agent or Firm:
Mizogami, Mitsuyoshi (10-4 Utsubohonmachi 1-chome, Nishi-k, Osaka-shi Osaka, JP)
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