Title:
METHOD AND DEVICE FOR REMOVING IC COMPONENT
Document Type and Number:
WIPO Patent Application WO/1997/039611
Kind Code:
A1
Abstract:
When an IC component (1) is removed from the board (3), the tool (21) is positioned just above the IC component. Then the tool is descended to a predetermined position and covers the IC component mounted on the substrate by means of an adhesive agent, solder, or paste. Then, the IC component is removed from the substrate by rotating the tool. The IC component can be stripped off with a relatively small force so that a crack in the IC component as well as damage to the board is prevented to a minimum.
Inventors:
NISHIDA KAZUTO (JP)
Application Number:
PCT/JP1997/001307
Publication Date:
October 23, 1997
Filing Date:
April 16, 1997
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
NISHIDA KAZUTO (JP)
NISHIDA KAZUTO (JP)
International Classes:
H05K13/04; H05K13/00; (IPC1-7): H05K13/00; H05K3/34; B23P21/00
Foreign References:
| JPH04318947A | 1992-11-10 | |||
| JPS5683927A | 1981-07-08 | |||
| JPS6331573U | 1988-03-01 | |||
| JPS5366571A | 1978-06-14 | |||
| JPS63142895A | 1988-06-15 |
Other References:
See also references of EP 0991310A4
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