METHOD AND DEVICE FOR SPOT SOLDERING WITH HEATED SOLDER

Title:

METHOD AND DEVICE FOR SPOT SOLDERING WITH HEATED SOLDER

Document Type and Number:

WIPO Patent Application WO2005046922

Kind Code:

A3

Abstract:

The invention relates to a method and a device (Fig. 1), for the production of material connections, for example, in the assembly of electronic components. The supplied solder wire (3a) is heated in a dosing pipette (11), fused and supplied to the soldering point (1) as a fluid. The solder wire (3a) is heated by a hot gas flow (7a), which also heats the soldering point (1) to the soldering temperature.

Inventors:

NIEMEIER JOERG (DE)
SONNTAG ANDREAS (DE)
SELIGER GUENTHER (DE)

Application Number:

PCT/DE2004/002502

Publication Date:

October 27, 2005

Filing Date:

November 09, 2004

Export Citation:

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Assignee:

ATN AUTOMATISIERUNGSTECHNIK NI (DE)
NIEMEIER JOERG (DE)
SONNTAG ANDREAS (DE)
SELIGER GUENTHER (DE)

International Classes:

B23K1/012; (IPC1-7): B23K1/012

Foreign References:

US5295619A	1994-03-22
US20020079305A1	2002-06-27
US5340016A	1994-08-23

Other References:

CRAWFORD D J: "Soldering Tool Employing Hot Vapors", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 22, no. 5, 1 October 1979 (1979-10-01), pages 1833 - 1838, XP002267349, ISSN: 0018-8689

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