Title:
METHOD AND DEVICE FOR SUBSTRATE PROCESSING
Document Type and Number:
WIPO Patent Application WO/2021/039218
Kind Code:
A1
Abstract:
In this substrate processing method, a substrate processing device is prepared which comprises a rotatable stage on which a substrate is mounted, a frozen heat transfer body which is arranged fixed on the back side of the stage and separated from the stage by a gap and which is cooled to an extremely low temperature, a gas supply mechanism which supplies a cooling gas into said gap for transferring the cold heat of the frozen heat transfer body to the stage, a rotation mechanism which rotates the stage, and a processing mechanism which processes the substrate; the stage is preheated such that the stage temperature is a steady cooled temperature within a fixed range; after preheating, while the substrate, at a specific temperature greater than or equal to room temperature, is mounted on the stage, which is at the steady cooled temperature; and a plurality of substrates is continuously subjected to substrate processing performed with the processing mechanism while rotating the stage.
Inventors:
TAKEYAMA TAMAKI (JP)
CHIHAYA HIROAKI (JP)
YAMAGATA MOTOI (JP)
NAKAGAWASAI MANABU (JP)
ORIMOTO SHINJI (JP)
CHIHAYA HIROAKI (JP)
YAMAGATA MOTOI (JP)
NAKAGAWASAI MANABU (JP)
ORIMOTO SHINJI (JP)
Application Number:
PCT/JP2020/028289
Publication Date:
March 04, 2021
Filing Date:
July 21, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/683; C23C14/34; C23C14/50
Domestic Patent References:
| WO2017221631A1 | 2017-12-28 |
Foreign References:
| JPH04176121A | 1992-06-23 | |||
| JPH0945751A | 1997-02-14 | |||
| JP2001335927A | 2001-12-07 | |||
| JPH0570948A | 1993-03-23 |
Attorney, Agent or Firm:
TAKAYAMA Hiroshi (JP)
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