Title:
METHOD AND DEVICE FOR TRANSFERRING CURVED SURFACE OF MICRO DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/013477
Kind Code:
A1
Abstract:
A method for transferring a curved surface of a micro device, according to an embodiment of the present invention, comprises the steps of: coating an adhesive layer on the outer circumferential surface of a tube; providing a micro device pattern on one surface of a substrate; positioning the substrate to be in contact with the outer circumferential surface of the tube and relatively moving at least one of the substrate and the tube to intersect so as to transfer, to the adhesive layer, the micro device pattern on the substrate; and curing the adhesive layer so as to fix the transferred micro device pattern on the adhesive layer.
Inventors:
JANG BONGKYUN (KR)
KIM JAE-HYUN (KR)
KIM KYUNG-SIK (KR)
LEE SEUNG-MO (KR)
JUNG HYUN JUNE (KR)
LEE HAK JOO (KR)
KIM JAE-HYUN (KR)
KIM KYUNG-SIK (KR)
LEE SEUNG-MO (KR)
JUNG HYUN JUNE (KR)
LEE HAK JOO (KR)
Application Number:
PCT/KR2019/007550
Publication Date:
January 16, 2020
Filing Date:
June 21, 2019
Export Citation:
Assignee:
KOREA INST MACH & MATERIALS (KR)
CT ADVANCED META MAT (KR)
CT ADVANCED META MAT (KR)
International Classes:
B41F17/10; B41F16/00
Foreign References:
| KR20130061720A | 2013-06-11 | |||
| KR101255726B1 | 2013-04-17 | |||
| KR940002177B1 | 1994-03-18 | |||
| KR20150093437A | 2015-08-18 | |||
| KR20170011770A | 2017-02-02 |
Attorney, Agent or Firm:
PANKOREA PATENT AND LAW FIRM (KR)
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