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Title:
METHOD AND DEVICE FOR WINDING LONG SUBSTRATE, AND LONG SUBSTRATE SURFACE PROCESSING DEVICE PROVIDED WITH WINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/073411
Kind Code:
A1
Abstract:
Provided is a method for winding a long substrate in which a banded pattern does not readily occur in both end portions of a wound long substrate. A method for winding a long substrate, for winding a long resin film or other long substrate conveyed in roll-to-roll fashion on a cylindrical winding core, wherein both end parts in the width direction of the long substrate are wound so as to be positioned farther from a central axis of rotation of the winding core than a center part in the width direction, preferably 50-200 µm farther at a distal end part of the long substrate wound first in contact with an external peripheral face of the winding core during winding of the long substrate (F) on the winding core (26).

Inventors:
TANBA Hironori (Sumitomo Metal Mining Co. Ltd., 17-5, Isoura-cho, Niihama-sh, Ehime 02, 〒7920002, JP)
Application Number:
JP2016/080885
Publication Date:
May 04, 2017
Filing Date:
October 18, 2016
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO., LTD. (11-3, Shimbashi 5-chome Minato-k, Tokyo 16, 〒1058716, JP)
International Classes:
B65H18/28; C23C14/56
Foreign References:
JP2015053353A2015-03-19
JPH0958935A1997-03-04
Attorney, Agent or Firm:
TSUJIKAWA Michinori (Taishodo Bldg, 6F 14-16, Shiba 5-chome, Minato-k, Tokyo 14, 〒1080014, JP)
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