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Patent Searching and Data


Title:
METHOD FOR DISMANTLING ADHESIVE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/031466
Kind Code:
A1
Abstract:
Provided is a method for dismantling an adhesive structure (1) provided with a pair of adhering bodies (2, 3) of the same or different materials and an induction heating adhesive sheet (4) interposed between the pair of adhering bodies (2, 3) and adhering the pair of adhering bodies (2, 3) to each other, wherein the method executes a first step for heating the induction heating adhesive sheet (4) by induction heating and a second step for separating the pair of adhering bodies (2, 3) by applying an outside force to the pair of adhering bodies (2, 3) and/or the induction heating adhesive sheet (4).

Inventors:
ISHIKAWA Masakazu (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
JP2018/029479
Publication Date:
February 14, 2019
Filing Date:
August 06, 2018
Export Citation:
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Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
International Classes:
C09J5/00; B09B5/00; C09J11/04; C09J201/00
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (3rd Floor, 26-13 Ogikubo 5-chome, Suginami-k, Tokyo 51, 〒1670051, JP)
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