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Patent Searching and Data


Title:
METHOD OF DIVIDING BRITTLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/145937
Kind Code:
A1
Abstract:
In the present invention, prepared is a blade tip (51) that has first to third surfaces (SD1-SD3) and as a result has a ridge line (PS) and an apex (PP). A groove-shaped trench line (TL) is formed in a crackless state by sliding the blade tip (51) along one surface (SF1) of a brittle substrate (4) in a direction from the ridge line (PS) toward the first surface (SD1). A crack line (CL) is formed by cutting downward at an edge (ED) of the brittle substrate (4) using the ridge line (PS) of the blade tip (51) so as to cause a crack in the brittle substrate (4) in a thickness direction (DT) to extend along the trench line (TL) from the edge (ED). A continuous connection of the brittle substrate (4) in a direction that intersects the trench line (TL) is broken by the crack line (CL) below the trench line (TL).

Inventors:
SOYAMA HIROSHI (JP)
Application Number:
PCT/JP2017/005934
Publication Date:
August 31, 2017
Filing Date:
February 17, 2017
Export Citation:
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Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
B28D5/00; C03B33/027; C03B33/033
Domestic Patent References:
WO2015151755A12015-10-08
Foreign References:
JP2016009773A2016-01-18
JP2014031292A2014-02-20
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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