Title:
METHOD FOR DOUBLE-SIDED POLISHING OF WAFER, AND DOUBLE-SIDED-POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2014/185008
Kind Code:
A1
Abstract:
The present invention is: a method for double-sided polishing of a wafer using a plurality of double-sided-polishing devices for polishing both sides of a wafer simultaneously while holding a wafer retained in a carrier between upper and lower surface plates to which a polishing cloth is affixed, causing the carrier to rotate and revolve, supplying a polishing agent, and measuring the thickness of the wafer by a light reflection interference method using a variable-wavelength infrared laser, the method for double-sided polishing of a wafer being characterized by measuring the thickness of the wafer while radiating the variable-wavelength infrared lasers used by each of the plurality of double-sided-polishing devices so that the double-sided-polishing device to be irradiated from a single laser light source is switched, and double-sided polishing is performed until the wafer attains a target thickness; and a double-sided-polishing system. By this invention, in double-sided polishing that is performed while measuring the thickness of a wafer using a variable-wavelength infrared laser, equipment cost can be reduced without decreasing the precision of measurement of the thickness of the wafer, particularly for wafers having low resistivity.
Inventors:
AOKI KAZUAKI (JP)
Application Number:
PCT/JP2014/002176
Publication Date:
November 20, 2014
Filing Date:
April 17, 2014
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/013; B24B37/08; G01B11/06; H01L21/304
Foreign References:
| JP2010034462A | 2010-02-12 | |||
| JPH0929626A | 1997-02-04 | |||
| JP2000317820A | 2000-11-21 | |||
| JP2011076669A | 2011-04-14 | |||
| JP2009103630A | 2009-05-14 | |||
| JPH09210636A | 1997-08-12 | |||
| JPH04319614A | 1992-11-10 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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