Title:
METHOD FOR DRAWING CUTTING AID LINE
Document Type and Number:
WIPO Patent Application WO/2010/064571
Kind Code:
A1
Abstract:
A method for drawing a cutting aid line is provided in which a cutting aid line can be drawn on a film regardless of the thickness of the film, the cutting aid line rendering the film cuttable along a given line. The method for drawing a cutting aid line comprises: sandwiching a film which is either a food-packaging material or a component of the packaging material between a horn to which an ultrasonic wave is propagated and a pedestal; and propagating an ultrasonic wave to the horn, with the film thus sandwiched, thereby melting the film and drawing a groove-shaped cutting aid line on the film. The pedestal has an end part for sandwiching the film between the end part and the horn, the end part being tapered in at least one direction. While the film sandwiched between the horn and the pedestal is tensed in the direction perpendicular to the width direction of the end part of the pedestal, an ultrasonic wave is propagated to the horn, thereby drawing on the film a cutting aid line extending in the direction perpendicular to the width direction of the end part of the pedestal.
Inventors:
KAMIYA, Tomoki (7-8, Narashino 4-chome, Funabashi-sh, Chiba 02, 〒2748502, JP)
Application Number:
JP2009/069940
Publication Date:
June 10, 2010
Filing Date:
November 26, 2009
Export Citation:
Assignee:
HOWA SANGYO CO., LTD. (11-10, Narashino 4-chome Funabashi-sh, Chiba 02, 〒2748502, JP)
朋和産業株式会社 (〒02 千葉県船橋市習志野４丁目１１番１０号 Chiba, 〒2748502, JP)
朋和産業株式会社 (〒02 千葉県船橋市習志野４丁目１１番１０号 Chiba, 〒2748502, JP)
International Classes:
B65B41/00; B65D65/10; B65D65/28; B65D85/50; B65B41/00; B65D65/02; B65D65/22; B65D85/50
Attorney, Agent or Firm:
FUJIMOTO, Noboru (Sakaisuji-Inabata Bldg. 2F, 15-14 Minamisemba 1-chome, Chuo-ku, Osaka-sh, Osaka 81, 〒5420081, JP)