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Title:
METHOD FOR DRILLING MOTHER GLASS SUBSTRATE, AND MOTHER GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2012/053488
Kind Code:
A1
Abstract:
The present invention is a method for drilling a mother glass substrate for a plasma display panel, wherein a rotating drill is moved to the mother glass substrate side, and a hole is made in the mother glass substrate. The method has: a first step wherein the position of the maximum radius of the drill while the drill is rotating is detected; a second step wherein the rotation of the drill is stopped or decelerated after the mother glass substrate is drilled; and a third step wherein the drill is removed in the case where the maximum radius position of the drill is within a predetermined safe region in the circumferential direction of the hole, and in the case where the maximum radius position of the drill is not within the safe region of the hole, the stop position or the decelerating position of the drill is adjusted.

Inventors:
TEI SEIKICHI (JP)
TANAKA HIROKI (JP)
NONAKA YASUSHI (JP)
ISHIKAWA KAZUYA (JP)
Application Number:
PCT/JP2011/073863
Publication Date:
April 26, 2012
Filing Date:
October 17, 2011
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
TEI SEIKICHI (JP)
TANAKA HIROKI (JP)
NONAKA YASUSHI (JP)
ISHIKAWA KAZUYA (JP)
International Classes:
C03B33/02; B28D1/14; H01J9/24; H01J11/22; H01J11/34
Domestic Patent References:
WO2008044771A12008-04-17
Foreign References:
JP2009149471A2009-07-09
JP2008137354A2008-06-19
Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
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Claims: