Title:
METHOD OF ELECTROLESS PLATING
Document Type and Number:
WIPO Patent Application WO/2004/031447
Kind Code:
A1
Abstract:
A method of electroless plating which comprises supplying an electroless plating solution, and then placing the plating solution under a condition for accelerating a reaction to thereby start the formation of a plated coating. In the step of supplying the electroless plating solution, no or little plated coating is formed, which allows the improvement of the uniformity of the resultant electrolessly plated coating, through supplying the plating solution over whole the surface of a substrate before the start of regular formation of the plated coating.
Inventors:
MARUMO YOSHINORI (JP)
Application Number:
PCT/JP2003/006500
Publication Date:
April 15, 2004
Filing Date:
May 23, 2003
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
MARUMO YOSHINORI (JP)
MARUMO YOSHINORI (JP)
International Classes:
B05D1/00; C23C18/16; C23C18/31; C25D5/02; H01L21/288; (IPC1-7): C23C18/31; H01L21/288
Domestic Patent References:
| WO1997046732A1 | 1997-12-11 |
Foreign References:
| EP0901153A2 | 1999-03-10 | |||
| JPH0878801A | 1996-03-22 | |||
| JPS59211566A | 1984-11-30 | |||
| JPH10298771A | 1998-11-10 | |||
| US20010051211A1 | 2001-12-13 | |||
| JP3274381B2 | 2002-04-15 | |||
| JPS55117299A | 1980-09-09 |
Attorney, Agent or Firm:
Suyama, Saichi (1 Kandata-cho 2-chom, Chiyoda-ku Tokyo, JP)
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