Title:
METHOD FOR ENCAPSULATING COMPONENT AND STRUCTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/150879
Kind Code:
A3
Abstract:
The method for encapsulating component (1) comprises the following steps: (a) processing the first surface of a plastic part by surface mounting technology and/or die bonding; (b) encapsulating the first surface of the processed plastic part with plastic; (c) processing the second surface of the processed plastic part by surface mounting technology and/or die bonding; (d) encapsulating the second surface of the processed plastic part with plastic. And the encapsulation structure comprises a substrate (2). Components (1) are fixed on the upper and lower surfaces of the substrate (2). The components (1) are encapsulated in the plastics (5). The method reduces warpage of the substrate (2). The structure has characteristics of dustproof, waterproof, good internal sealability.
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| JPS58138613 | CASTING MOLD DEVICE |
Inventors:
YANG XIONG (CN)
Application Number:
PCT/CN2011/076087
Publication Date:
May 24, 2012
Filing Date:
June 22, 2011
Export Citation:
Assignee:
HUAWEI DEVICE CO LTD (CN)
YANG XIONG (CN)
YANG XIONG (CN)
International Classes:
B29C39/42; H01L21/56; H01L23/31
Foreign References:
| CN101110406A | 2008-01-23 | |||
| CN101110406A | 2008-01-23 | |||
| CN101611483A | 2009-12-23 |
Other References:
See also references of EP 2565913A4
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY (He Jing Yuan Ji Men Li, Xueyuan Roa, Haidian District Beijing City 8, CN)
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