Title:
METHOD AND EQUIPMENT FOR CLEANING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2002/083331
Kind Code:
A1
Abstract:
A method and equipment for cleaning various kinds of substrate, e.g. a glass substrate of liquid crystal display or photomask, a printed wiring board or a semiconductor wafer. The cleaning equipment comprises a tank (3) storing cleaning water, means (6) for supporting a substrate W movably in the horizontal direction such that the rear surface thereof touches the cleaning water in the water storage tank (3), means (1) for supplying the cleaning water imparted with ultrasonic vibration to the surface of the substrate W, and means R and r for carrying the substrate W between the water storage tank (3) and the cleaning water supply means (1). Ultrasonic vibration imparted to the cleaning water being supplied onto the surface of the substrate W is transmitted through the substrate W to the rear surface thereof thus imparting ultrasonic vibration to the cleaning water touching the rear surface. The substrate W is cleaned effectively, both on the surface and rear surface thereof, by the cleaning water imparted with ultrasonic vibration.
Inventors:
MIZUKAWA SHIGERU
NAKATA KATSUTOSHI
MATSUMOTO SHUNJI
NAKATA KATSUTOSHI
MATSUMOTO SHUNJI
Application Number:
PCT/JP2002/003514
Publication Date:
October 24, 2002
Filing Date:
April 08, 2002
Export Citation:
Assignee:
SUMITOMO PRECISION PROD CO (JP)
International Classes:
G02F1/13; B08B3/02; B08B3/12; G02F1/1333; H01L21/304; (IPC1-7): B08B3/12
Foreign References:
| JPH02250324A | 1990-10-08 | |||
| JP2001007017A | 2001-01-12 | |||
| JPH10309548A | 1998-11-24 | |||
| JPH0195521A | 1989-04-13 |
Attorney, Agent or Firm:
Murakami, Satoshi (Rise 88 Bldg. 1-10 Honjo-Higashi 1-chom, Kita-ku Osaka-shi Osaka, JP)
Download PDF:
Previous Patent: DEVICE FOR CLEANING ASHTRAYS
Next Patent: METHOD AND APPARATUS TO REDUCE DEFORMATION IN SHEETS CUT BY A CUTTING TOOL
Next Patent: METHOD AND APPARATUS TO REDUCE DEFORMATION IN SHEETS CUT BY A CUTTING TOOL