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Title:
METHOD FOR ETCHING RESIN SURFACE AND METHOD FOR PLATING RESIN UTILIZING SAID ETCHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/094754
Kind Code:
A1
Abstract:
Provided is a novel etching technique for resins, which does not use chromic acid and is able to be put in industrial practice. A method for etching a resin surface, which is characterized by comprising the following steps (a) and (b). (a) A step wherein a resin is treated with a solution that contains an oxidant so that the oxidant is adsorbed on the resin surface. (b) A step wherein the oxidant, which is adsorbed on the resin surface in step (a), is activated.

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Inventors:
KURAMOCHI YASUYUKI (JP)
HORI MASAO (JP)
IZUMITANI MIYOKO (JP)
Application Number:
PCT/JP2016/085497
Publication Date:
June 08, 2017
Filing Date:
November 30, 2016
Export Citation:
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Assignee:
JCU CORP (JP)
International Classes:
C23C18/22; C09K13/06; C09K13/12
Domestic Patent References:
WO2008143190A12008-11-27
Foreign References:
JP2007100174A2007-04-19
JP2003055774A2003-02-26
JP2009022948A2009-02-05
Attorney, Agent or Firm:
THE PATENT CORPORATE BODY OF ONO & CO. (JP)
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