Title:
METHOD FOR EVALUATING ABRASIVE GRAINS, AND METHOD FOR MANUFACTURING SILICON WAFER
Document Type and Number:
WIPO Patent Application WO/2016/103854
Kind Code:
A1
Abstract:
A method for evaluating abrasive grains used in a slurry for cutting ingots, wherein there are performed an evaluation-solution-preparation step (S1) for causing abrasive grains containing polishing abrasive grains and impurities to dissolve in a solvent to prepare an evaluation solution, a settling step (S3) in which a vessel containing the evaluation solution is left to stand and the polishing abrasive grains are allowed to settle, a measurement step (S5) for measuring the turbidity of the supernatant of the evaluation solution using a measuring device, and an estimation step (S6) for estimating the impurity content on the basis of the results obtained from measuring the turbidity of the supernatant.
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Inventors:
MINAMIHATA YUUJI (JP)
Application Number:
PCT/JP2015/078852
Publication Date:
June 30, 2016
Filing Date:
October 09, 2015
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B27/06; B24B57/02; G01N15/06; G01N21/49; G01N33/40; H01L21/304
Domestic Patent References:
| WO2013175859A1 | 2013-11-28 | |||
| WO2015091495A1 | 2015-06-25 |
Foreign References:
| JP2004111416A | 2004-04-08 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)
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