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Title:
METHOD OF EVALUATING CREEP LIFE EXPECTANCY OR LIFE SPAN
Document Type and Number:
WIPO Patent Application WO/2005/124314
Kind Code:
A1
Abstract:
A method of accurately evaluating the life expectancy or the life span of a creep-damaged device member, especially its fine-grained part. The life expectancy or the life span is represented by the time until the creep-damaged device member creep-ruptures. The number of linked voids present over a half or more of each length of two or more grain boundaries in areas of up to 1 mm2 of the surface of the device member is determined. The ratio of the number of linked voids to the area of 1 mm2 is used as an L parameter, and the life expectancy or the life span of the device member is evaluated on the basis of the L parameter.

Inventors:
NISHIDA HIDETAKA (JP)
Application Number:
PCT/JP2005/011267
Publication Date:
December 29, 2005
Filing Date:
June 20, 2005
Export Citation:
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Assignee:
CHUGOKU ELECTRIC POWER (JP)
NISHIDA HIDETAKA (JP)
International Classes:
G01M99/00; G01N3/32; G01N17/00; G01N33/20; (IPC1-7): G01N17/00; G01M19/00; G01N3/32; G01N33/20
Domestic Patent References:
WO2002014835A12002-02-21
Foreign References:
JPH11230928A1999-08-27
Other References:
KIKUCHI K. ET AL: "Yo Yugamizai no Ryukai Sonshoritsu", NIPPON KIKAI GAKKAI TSUJO SOKAI KOENKAI KOEN RONBUNSHU, vol. 73, no. 2, 1 April 1996 (1996-04-01), pages 274 - 275, XP002995865
KIKUCHI K. ET AL: "Ryukai Sonshoritsu Parameter no Teian", JOURNAL OF THE SOCIETY OF MATERIALS OF JAPAN, vol. 44, no. 505, 15 October 1995 (1995-10-15), pages 1244 - 1248, XP002995866
NISHIDA H.: "Koon Joki Haikan Yosetsubu ni Okeru Shin Yojumyo Shuho no Kaihatsu", NIPPON KIKAI GAKKAI ZAIRYO RIKIGAKU BUMON KOENKAI KOEN RONBUNSHU, 20 July 2004 (2004-07-20), pages 173 - 174, XP002995867
Attorney, Agent or Firm:
Hori, Susumu (1-1 Yoyogi 2-chom, Shibuya-ku Tokyo, JP)
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