Title:
METHOD FOR EVALUATING PICKABILITY, FILM FOR COMBINED DICING AND DIE BONDING, METHOD FOR EVALUATING AND METHOD FOR CLASSIFYING FILM FOR COMBINED DICING AND DIE BONDING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/230211
Kind Code:
A1
Abstract:
A method for evaluating pickability according to the present invention comprises: a step of preparing a film for combined dicing and die bonding to be evaluated, which includes, in the following order, a base layer, a pressure-sensitive adhesive layer, and a bonding layer; a first measurement step of measuring the adhesive force of the pressure-sensitive adhesive layer to the bonding layer under the condition of a peeling angle of 30°; a step of affixing a wafer having a thickness of 10 to 100 μm to the boding layer of the film for combined dicing and die bonding; a step of singulating the wafer and the bonding layer into chips with bonding pieces, each chip having an area of 9 mm2 or less; and a second measurement step of pushing down the center of a chip with a bonding piece from the base layer side and measuring the edge peel strength when the edge of the chip with a bonding piece peels from the pressure-sensitive adhesive layer.
Inventors:
TAZAWA TSUYOSHI (JP)
KIMURA NAOHIRO (JP)
OHKUBO KEISUKE (JP)
OZAKI YOSHINOBU (JP)
KIMURA NAOHIRO (JP)
OHKUBO KEISUKE (JP)
OZAKI YOSHINOBU (JP)
Application Number:
PCT/JP2019/018820
Publication Date:
November 19, 2020
Filing Date:
May 10, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L21/301
Domestic Patent References:
| WO2016140163A1 | 2016-09-09 |
Foreign References:
| JP2018107386A | 2018-07-05 | |||
| JP2014045034A | 2014-03-13 | |||
| JP2016015456A | 2016-01-28 | |||
| JP2012153819A | 2012-08-16 | |||
| JP2014099620A | 2014-05-29 | |||
| JP2012069586A | 2012-04-05 | |||
| JP2014135469A | 2014-07-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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