Title:
METHOD FOR FABRICATING PACKAGE SUBSTRATE, AND PACKAGE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/011016
Kind Code:
A1
Abstract:
An embodiment of the present application relates to the technical field of electronic packaging, and discloses a method for fabricating a package substrate as well as a package substrate, which solve the problem of a package substrate and a carrier plate being cracked in advance during a packaging process. The specific solution is as follows: the method for fabricating a package substrate comprises: fabricating first double-layered removable metal foil on two bearing surfaces of an initial carrier plate respectively, said first double-layered removable metal foil comprising a first metal supporting layer and a first metal thin film layer; fabricating at least one layer of a wiring structure on an outer surface of the first metal thin film layer; fabricating a first solder-resist resin layer on an outer surface of the one layer of the wiring structure that is farthest from the initial carrier plate; fabricating second double-layered removable metal foil on an outer surface of the first solder-resist resin layer, said second double-layered removable metal foil comprising a second metal thin film layer and a second metal supporting layer; separating the first metal thin film layer from the first metal supporting layer; fabricating a reinforcing layer at least on an outer surface of the second metal supporting layer, a part of the reinforcing layer being connected to the first solder-resist resin layer. The embodiment of the present application fabricates a tape carrier package substrate.
Inventors:
CHANG MING (CN)
ZHANG XIAODONG (CN)
HUANG JING (CN)
ZHANG XIAODONG (CN)
HUANG JING (CN)
Application Number:
PCT/CN2018/082199
Publication Date:
January 17, 2019
Filing Date:
April 08, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L21/48; H01L23/492; H01L23/498
Foreign References:
| CN102054714A | 2011-05-11 | |||
| CN104183567A | 2014-12-03 | |||
| US9653430B2 | 2017-05-16 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
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