Title:
METHOD OF FABRICATING WAFER
Document Type and Number:
WIPO Patent Application WO/2012/177086
Kind Code:
A2
Abstract:
A method of fabricating a wafer according to the embodiment comprises the steps of growing an wafer on a surface of the wafer in a growth temperature; and cooling the wafer after the wafer has been grown, wherein a stepwise cooling is performed when cooling the wafer.
Inventors:
KANG SEOK MIN (KR)
KIM MOO SEONG (KR)
KIM MOO SEONG (KR)
Application Number:
PCT/KR2012/004963
Publication Date:
December 27, 2012
Filing Date:
June 22, 2012
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
KANG SEOK MIN (KR)
KIM MOO SEONG (KR)
KANG SEOK MIN (KR)
KIM MOO SEONG (KR)
International Classes:
H01L21/20; H01L21/324
Foreign References:
| KR100845946B1 | 2008-07-11 | |||
| JP2008115035A | 2008-05-22 | |||
| KR20020010708A | ||||
| KR100193052B1 | 1999-07-01 |
Attorney, Agent or Firm:
SEO, Kyo Jun (832-41,Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
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