Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR FILMING RESIN FILM, AND MASK
Document Type and Number:
WIPO Patent Application WO/2018/155440
Kind Code:
A1
Abstract:
This method for forming a patterned resin film on a substrate involves, in order, at least: a first step in which a mask is used having a mask main body structured such that a flexible support part and an adhesive part overlap, and the mask is disposed such that the adhesive part contacts the substrate; a second step in which a gasified resin material is supplied to the substrate through an opening provided in the mask main body and is condensed on the substrate, and, after formation of the liquid resin material film on the substrate, the resin material film and the mask are irradiated with UV light; and a third step in which the mask is separated from the substrate.

Inventors:
AODAI Makoto (Inc. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
SEI Kensuke (Inc. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
TAKAHASHI Hirohisa (Inc. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
Application Number:
JP2018/006003
Publication Date:
August 30, 2018
Filing Date:
February 20, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ULVAC, INC. (2500, Hagisono Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
International Classes:
C23C14/12; B05D1/32; C23C14/04; C23C14/58; H01L51/50; H05B33/04
Attorney, Agent or Firm:
OIKAWA Shu et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
Download PDF:



 
Previous Patent: RADAR DEVICE

Next Patent: PNEUMATIC TIRE