Title:
METHOD OF FORMING AUXILIARY ELECTRODE LAYER FOR COMMON ELECTRODE PATTERN IN THERMAL HEAD
Document Type and Number:
WIPO Patent Application WO/1996/041722
Kind Code:
A1
Abstract:
A method of forming an auxiliary electrode layer for a common electrode pattern in a thermal head. The method comprises the steps of preparing a master substrate (1') which has a common electrode pattern (4) on a surface thereof and accommodates for a plurality of head substrates, forming at least one slit (9) on the master substrate (1') along the common electrode pattern (4), and forming an auxiliary electrode layer (6) on the back surface of the master substrate (1') such that the auxiliary electrode layer (6) extends to be connected electrically with the common electrode pattern (4) through the slit (9). The slit (9) is regulated to have a width of 0.5 mm or more, preferably 0.8 mm or more so as to make an appropriate extent (R), over which the auxiliary electrode layer (6) extends.
Inventors:
HOUKI HIDEAKI (JP)
Application Number:
PCT/JP1996/001632
Publication Date:
December 27, 1996
Filing Date:
June 13, 1996
Export Citation:
Assignee:
ROHM CO LTD (JP)
HOUKI HIDEAKI (JP)
HOUKI HIDEAKI (JP)
International Classes:
B41J2/335; (IPC1-7): B41J2/335
Foreign References:
| JPS6225067A | 1987-02-03 | |||
| JPS61187292A | 1986-08-20 | |||
| JPH02179765A | 1990-07-12 | |||
| JPH05330107A | 1993-12-14 |
Other References:
See also references of EP 0775584A4
Download PDF: