Title:
METHOD OF FORMING CIRCUIT BODY AND CIRCUIT BODY
Document Type and Number:
WIPO Patent Application WO/2018/092798
Kind Code:
A1
Abstract:
According to the present invention, a conductive part (11) of a circuit body (10) is formed by being sprayed onto a surface (1s) of a resin housing (1) through thermal-spraying. A cold spraying method, in which metal powder and an inert gas are sprayed onto a subject, is used to form the conductive part (11) through the thermal-spraying. A circuit component (20) is mounted on the conductive part (11). Connectors (30) for connecting to an external circuit body are provided on respective terminal sections (11t) of the conductive part (11). An insulating resin (40) is laminated on the surface of the conductive part (11). Through said series of the steps described above, the circuit body (10) is directly formed on the surface (1s) of the resin housing (1).
Inventors:
SHIMAKURA KEITA (JP)
MATSUMOTO TAKUO (JP)
MATSUMOTO TAKUO (JP)
Application Number:
PCT/JP2017/041072
Publication Date:
May 24, 2018
Filing Date:
November 15, 2017
Export Citation:
Assignee:
YAZAKI CORP (JP)
International Classes:
H01B13/00; C23C24/04
Foreign References:
| JP2012009499A | 2012-01-12 | |||
| JP2011132561A | 2011-07-07 | |||
| JP2000244100A | 2000-09-08 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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