Title:
METHOD FOR FORMING COATING FILM AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2015/001936
Kind Code:
A1
Abstract:
A method for forming a coating film on a substrate that is provided with an uneven pattern, which comprises: a first heating step for heating a substrate, to which a coating liquid has been applied, at a first temperature that is not less than the volatilization temperature of the solvent of the coating liquid but lower than the glass transition temperature thereof; a second heating step for heating the substrate at a second temperature that is not less than the glass transition temperature of the coating liquid but lower than the crosslinking initiation temperature of the coating liquid; and a third heating step for forming a coating film by heating the substrate at a third temperature that is not less than the crosslinking initiation temperature of the coating liquid but lower than the material decomposition temperature of the coating film. In this connection, the substrate is heated by means of light irradiation.
Inventors:
UEDA KENICHI (JP)
Application Number:
PCT/JP2014/065576
Publication Date:
January 08, 2015
Filing Date:
June 12, 2014
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; B05C9/14; G03F7/16; H01L21/3065; H05B3/10
Foreign References:
| JP2001188357A | 2001-07-10 | |||
| JPH0561206A | 1993-03-12 | |||
| JPH0289059A | 1990-03-29 | |||
| JPS6381923A | 1988-04-12 | |||
| JPS6381820A | 1988-04-12 | |||
| JP2008186934A | 2008-08-14 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
Tetsuo Kanamoto (JP)
Download PDF: