METHOD FOR FORMING COATING FILM

WIPO Patent Application WO/2011/118791

A1

Disclosed is a method for forming a coating film, which has excellent curability at low temperatures. Specifically disclosed is a method for forming a coating film, which comprises a process wherein a coating film is formed by applying an aqueous coating composition over a base. The aqueous coating composition contains (A) an aqueous epoxy polyamine resin that has one or more first amino groups and/or second amino groups in each molecule and (B) a compound that has one or more (meth)acryloyl groups in each molecule. In a preferable embodiment of the present invention, the aqueous coating composition is a two pack type aqueous coating composition in which the main coating material liquid contains the aqueous epoxy polyamine resin (A) and the curing agent contains the compound (B).

SHO, Katsuhiko (19-17, Ikedanakamachi, Neyagawa-sh, Osaka 01, 〒5728501, JP)
庄　克彦 (〒01 大阪府寝屋川市池田中町１９番１７号　日本ペイント株式会社内 Osaka, 〒5728501, JP)
IMAMURA, Muneo (19-17, Ikedanakamachi, Neyagawa-sh, Osaka 01, 〒5728501, JP)

JP2011/057407

September 29, 2011

March 25, 2011

Click for automatic bibliography generation  

NIPPON PAINT CO., LTD. (2-1-2, Oyodokita Kita-ku, Osaka-sh, Osaka 11, 〒5318511, JP)
日本ペイント株式会社 (〒11 大阪府大阪市北区大淀北２丁目１番２号 Osaka, 〒5318511, JP)
SHO, Katsuhiko (19-17, Ikedanakamachi, Neyagawa-sh, Osaka 01, 〒5728501, JP)
庄　克彦 (〒01 大阪府寝屋川市池田中町１９番１７号　日本ペイント株式会社内 Osaka, 〒5728501, JP)

B05D7/24; C09D4/00; C09D163/00

MOMII, Takafumi (7th Floor, Chiyoda Building Bekkan 6-1-2, Nishitemma, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)

View/Download PDF      PDF Help

Previous Patent: WATER-BASED COATING COMPOSITION, AND PROCESS FOR FORMATION OF COATING FILM AND PROCESS FOR FORMATION...

Next Patent: WATER-BASED COATING COMPOSITION AND PROCESS FOR FORMATION OF COATING FILM