Title:
METHOD FOR FORMING COATING FILM
Document Type and Number:
WIPO Patent Application WO/2020/116215
Kind Code:
A1
Abstract:
The present invention relates to a method for forming a coating film, which comprises: a step 1 wherein a liquid composition I that contains a solvent A, a solvent B and a polymer C is applied to a base material; and a step 2 wherein droplets of a liquid II that contains water are applied to the liquid composition I that has been applied onto the base material in the step 1. This method for forming a coating film is configured such that: the solvent A has a boiling point of less than 99°C; the distance Ra of the Hansen solubility parameter of the solvent A with respect to water is 36 or less; the solvent B has a boiling point of 150°C or more; the distance Ra of the Hansen solubility parameter of the solvent B with respect to water is 40 or more; the solvent B and the solvent A are compatible with each other; the polymer C is soluble in the solvent A, but is not soluble in the solvent B; and the average diameter d of the droplets applied in the step 2 is from 0.01 μm to 50 μm (inclusive).
Inventors:
FUKUDA TERUYUKI (JP)
Application Number:
PCT/JP2019/045886
Publication Date:
June 11, 2020
Filing Date:
November 22, 2019
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
B05D1/36; B05D3/00; C09D7/20; C09D201/00
Domestic Patent References:
WO2018051794A1 | 2018-03-22 | |||
WO2008044630A1 | 2008-04-17 |
Foreign References:
JP2018090739A | 2018-06-14 | |||
CN102485341A | 2012-06-06 | |||
JP2018123208A | 2018-08-09 | |||
JP2014058626A | 2014-04-03 | |||
JP2010520943A | 2010-06-17 | |||
JP2012126907A | 2012-07-05 | |||
JPS58164622A | 1983-09-29 | |||
JP2018512265A | 2018-05-17 | |||
JP2011126978A | 2011-06-30 |
Other References:
"A User's Handbook", article "HANSEN SOLUBILITY PARAMETERS"
WESLEY L. ARCHER, INDUSTRIAL SOLVENTS HANDBOOK
See also references of EP 3892389A4
WESLEY L. ARCHER, INDUSTRIAL SOLVENTS HANDBOOK
See also references of EP 3892389A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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