Title:
METHOD FOR FORMING CONDUCTIVE POLYMER PATTERN
Document Type and Number:
WIPO Patent Application WO/2010/013642
Kind Code:
A1
Abstract:
Disclosed is a method for forming a patterned conductive layer containing a conductive polymer on the surface of a base. This method is characterized by using a positive photoresist composition containing a naphtoquinonediazide and a novolac resin, and by developing a resist film, which is obtained by using the photoresist composition, with a developer liquid having a potassium ion concentration of 0.08-0.20 mol/liter and a coexistent sodium ion concentration of less than 0.1 mol/liter.
Inventors:
TAGUCHI Hiromu (1-1, Funami-cho, Minato-k, Nagoya-shi Aichi 27, 〒4550027, JP)
Application Number:
JP2009/063216
Publication Date:
February 04, 2010
Filing Date:
July 23, 2009
Export Citation:
Assignee:
TOAGOSEI CO., LTD. (1-14-1, Nishi Shimbashi Minato-ku Tokyo, 19, 〒1058419, JP)
東亞合成株式会社 (〒19 東京都港区西新橋一丁目１４番１号 Tokyo, 〒1058419, JP)
TSURUMI SODA CO., LTD. (1-7 Suehiro-cho, Tsurumi-ku Yokohama-shi Kanagawa, 45, 〒2300045, JP)
東亞合成株式会社 (〒19 東京都港区西新橋一丁目１４番１号 Tokyo, 〒1058419, JP)
TSURUMI SODA CO., LTD. (1-7 Suehiro-cho, Tsurumi-ku Yokohama-shi Kanagawa, 45, 〒2300045, JP)
International Classes:
G03F7/32; G03F7/023; H01B13/00
Attorney, Agent or Firm:
KOJIMA Seiji (JINGUHIGASHI ATSUTA Bldg. 4F, 8-20 Jingu 3-chome, Atsuta-k, Nagoya-shi Aichi 31, 〒4560031, JP)