Title:
METHOD FOR FORMING CONDUCTOR LAYER, AND METHOD FOR PRODUCING MULTILAYER WIRING SUBSTRATE USING METHOD FOR FORMING CONDUCTIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2015/111638
Kind Code:
A1
Abstract:
The present invention pertains to a method for forming a conductor layer, wherein, after a polyimide etching process is performed on a surface provided to a polyimide layer (a) of a polyimide film in which the polyimide layer (a) is provided to one or both surfaces of a polyimide layer (b) so as to eliminate at least a portion of the polyimide layer (a), a conductor layer is formed on said surface. The method for forming the conductor layer is characterized in that the polyimide etching process time T (min.) represented using t (min.), which is defined by the illustrated formula, lies within the range 0.2t ≤ T ≤ 5t.
Inventors:
MIURA TORU (JP)
BAMBA KEITA (JP)
KOHDA MASAFUMI (JP)
YOKOZAWA TADAHIRO (JP)
BAMBA KEITA (JP)
KOHDA MASAFUMI (JP)
YOKOZAWA TADAHIRO (JP)
Application Number:
PCT/JP2015/051581
Publication Date:
July 30, 2015
Filing Date:
January 21, 2015
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
International Classes:
H01B13/00; B32B15/088; H05K1/03; H05K3/38; H05K3/46
Foreign References:
| JP2007119573A | 2007-05-17 | |||
| JPH0999518A | 1997-04-15 | |||
| JP2008068406A | 2008-03-27 | |||
| JPH03226916A | 1991-10-07 | |||
| JP2006305966A | 2006-11-09 | |||
| JP2004276401A | 2004-10-07 |
Attorney, Agent or Firm:
ITO, Katsuhiro et al. (JP)
Katsuhiro Ito (JP)
Katsuhiro Ito (JP)
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