Title:
METHOD FOR FORMING COVERING LAYER ON SURFACE OF METAL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/088114
Kind Code:
A1
Abstract:
Provided is a method by which a polymeric resin can be uniformly adhered to the surface of a metal substrate without creating a residual stress in the metal substrate. This method for forming a covering layer on the surface of a metal substrate includes: forming a resin-containing covering layer on at least a part of the surface of a metal substrate; and thereafter subjecting the covering layer on the surface of the metal substrate to isostatic pressing using a fluid to harden the covering layer.
More Like This:
| JPH05306474 | ALUMINUM MATERIAL HAVING EXCELLENT FORMABILITY, WELDABILITY AND CORROSION RESISTANCE |
| JP5382722 | Multi-layer coating |
| JPS60193535 | FILM FORMING DEVICE |
Inventors:
WATANABE MASAHIRO (JP)
YAMASHITA HISAO (JP)
YAMASHITA HISAO (JP)
Application Number:
PCT/JP2013/082904
Publication Date:
June 12, 2014
Filing Date:
December 03, 2013
Export Citation:
Assignee:
UNIV YAMANASHI (JP)
International Classes:
C23C26/00; B05D3/12; B05D5/12; B05D7/14; B30B5/02; H01M8/02; H01M8/10
Foreign References:
| JPS61173911A | 1986-08-05 | |||
| JPS6319897A | 1988-01-27 | |||
| JP2008162286A | 2008-07-17 | |||
| JP2007149661A | 2007-06-14 | |||
| JP2009266740A | 2009-11-12 |
Attorney, Agent or Firm:
USHIKU Kenji et al. (JP)
Ushiku Kenji (JP)
Ushiku Kenji (JP)
Download PDF: