Title:
METHOD OF FORMING ELECTRICAL WIRING AND METHOD OF REPAIRING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/141883
Kind Code:
A1
Abstract:
It is intended to provide a method of forming an electrical wiring, in which a paste
material containing metal nanoparticles, a binder comprising an organic compound
is applied on an insulating substrate thereby to form a pattern portion for wiring.
Then, on the pattern portion formed with the paste material, oxygen radical molecules
are sprayed. By this spraying of oxygen radical molecules, the organic compound
in the binder is oxidized and released in the atmosphere, and then the metal nanoparticles
directly come into contact with one another, whereby sintering occurs due to
the resulting high surface energy. By the sintering due to the mutual contact
of metal nanoparticles, a conductive portion is formed on the insulating substrate.
Inventors:
IKEDA, Masato (6-8, Kichij,ojihoncho 2-chome, Musashino-sh, Tokyo 04, 1800004, JP)
Application Number:
JP2006/311686
Publication Date:
December 13, 2007
Filing Date:
June 06, 2006
Export Citation:
Assignee:
KABUSHIKI KAISHA NIHON MICRONICS (6-8 Kichijojihoncho 2-chome, Musashino-shi Tokyo, 04, 1800004, JP)
株式会社日本マイクロニクス (〒04 東京都武蔵野市吉祥寺本町２丁目６番８号 Tokyo, 1800004, JP)
株式会社日本マイクロニクス (〒04 東京都武蔵野市吉祥寺本町２丁目６番８号 Tokyo, 1800004, JP)
International Classes:
H05K3/10; G09F9/00; G09F9/30; H05K3/24
Attorney, Agent or Firm:
MATSUNAGA, Nobuyuki et al. (Urban Toranomon Building, 7F 16-4, Toranomon 1-chom, Minato-ku Tokyo 01, 1050001, JP)
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