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Patent Searching and Data


Title:
METHOD OF FORMING MULTI−LAYER FILM
Document Type and Number:
WIPO Patent Application WO/2003/012887
Kind Code:
A1
Abstract:
A method of forming a multi−layer film comprising the steps of forming a diffusion prevention film on a substrate surface, migration−electrodepositing or electrodepositing a high−temperature superconductor and&sol or a high−temperature superconductor precursor, and heat treating the substrate to sinter the high−temperature superconductor and&sol or the high−temperature superconductor precursor and thereby form a superconducting film.

Inventors:
Kawachi, Masaharu (1-2-1, Yurinokidai Sanda-shi, Hyogo, 669-1324, JP)
Yoshizawa, Masahito (2-405, Iwatedaigaku-Takamatsushukusha 17-19, Takamatsu 4-chom, Morioka-shi Iwate, 020-0114, JP)
Application Number:
PCT/JP2002/006806
Publication Date:
February 13, 2003
Filing Date:
July 04, 2002
Export Citation:
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Assignee:
JAPAN SCIENCE AND TECHNOLOGY CORPORATION (1-8 Honcho 4-chome, Kawaguchi-shi, Saitama, 332-0012, JP)
Kawachi, Masaharu (1-2-1, Yurinokidai Sanda-shi, Hyogo, 669-1324, JP)
Yoshizawa, Masahito (2-405, Iwatedaigaku-Takamatsushukusha 17-19, Takamatsu 4-chom, Morioka-shi Iwate, 020-0114, JP)
International Classes:
C23C24/08; C23C26/00; C23C28/00; H01B13/00; H01L39/24; (IPC1-7): H01L39/24; C23C28/00; H01B13/00
Attorney, Agent or Firm:
Suzuye, Takehiko (Suzuye & Suzuye, 7-2 Kasumigaseki 3-chom, Chiyoda-ku Tokyo, 100-0013, JP)
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