Title:
METHOD FOR FORMING METAL COATING FILM, AND ELECTRICALLY CONDUCTIVE PARTICLE
Document Type and Number:
WIPO Patent Application WO/2010/035708
Kind Code:
A1
Abstract:
Disclosed is a method for forming a metal coating film, in which the metal coating film is formed on the surface of a non-electrically-conductive particle by electroless plating. In the method, the electroless plating is carried out after the pretreatment for attaching a metal core to the non-electrically-conductive particle and can form a metal coating film comprising silver in the presence of a hydrophilic polymer having a pyrrolidone group. Also disclosed is an electrically conductive particle which is imparted with electrical conductivity by forming a metal coating film on the whole surface of a non-electrically-conductive particle. The metal coating film comprises a coating film composed of only silver.
Inventors:
KURODA HIDEKATSU (JP)
Application Number:
PCT/JP2009/066366
Publication Date:
April 01, 2010
Filing Date:
September 18, 2009
Export Citation:
Assignee:
UBE NITTO KASEI CO (JP)
KURODA HIDEKATSU (JP)
KURODA HIDEKATSU (JP)
International Classes:
C23C18/44; G02F1/1339; H01B5/00; H01B13/00
Domestic Patent References:
| WO1994013876A1 | 1994-06-23 | |||
| WO2007058173A1 | 2007-05-24 |
Foreign References:
| JP2005325383A | 2005-11-24 | |||
| JPH07188936A | 1995-07-25 |
Attorney, Agent or Firm:
ONDA, Hironori et al. (JP)
Hironori Onda (JP)
Hironori Onda (JP)
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