Title:
METHOD FOR FORMING METAL FILM AND METHOD FOR FORMING METAL PATTERN
Document Type and Number:
WIPO Patent Application WO/2007/055223
Kind Code:
A1
Abstract:
Disclosed is a method for forming a metal film which is characterized by comprising a step (a1) for forming, on a substrate, a polymer layer composed of a polymer which has a functional group interacting with a metal ion or a metal salt and is chemically bonded to the substrate directly; a step (a2) for providing the polymer layer with a metal ion or a metal salt; a step (a3) for forming a conductive layer having a surface resistivity of 10-100 kΩ/□ by reducing the metal ion or the metal salt; and a step (a4) for forming a conductive layer having a surface resistivity of 1 × 10-1 Ω/□ or less by electroplating.
Inventors:
MATSUMOTO KAZUHIKO (JP)
Application Number:
PCT/JP2006/322238
Publication Date:
May 18, 2007
Filing Date:
November 08, 2006
Export Citation:
Assignee:
FUJIFILM CORP (JP)
MATSUMOTO KAZUHIKO (JP)
MATSUMOTO KAZUHIKO (JP)
International Classes:
C25D5/56; C23C18/16; C25D21/12; H05K1/03; H05K3/18; C08F292/00; C08J7/04
Foreign References:
| JP2005307140A | 2005-11-04 | |||
| JP2003213437A | 2003-07-30 | |||
| JP2002338636A | 2002-11-27 | |||
| JPH02175895A | 1990-07-09 | |||
| JP2005311268A | 2005-11-04 |
Other References:
TOYONAGA M.: "Print Haisenban no Mekki Gijutsu", 1996, pages: 224 - 225, XP003012663
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (NAKAJIMA & KATO Seventh Floor HK-Shinjuku Bldg., 3-17, Shinjuku 4-chom, Shinjuku-ku Tokyo 22, JP)
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