Title:
METHOD FOR FORMING METAL PATTERN
Document Type and Number:
WIPO Patent Application WO/2020/256072
Kind Code:
A1
Abstract:
The present invention relates to a method for forming a metal pattern at a pattern formation section set on a base material. In the present invention, a substrate is used which is provided with a fluorine-containing resin layer on a base material surface that includes the abovementioned pattern formation section. The method for forming a metal pattern according to the present invention includes: a step for forming a functional group at the pattern formation section; and a step for applying, to the base material surface, a metal ink having, as a protective agent, an amine compound and a fatty acid, and affixing metal particles to the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy of at least 13 mN/m and no more than 20 mN/m, as measured using the Owens-Wendt method, is applied as the fluorine-containing resin layer. Furthermore, a metal ink which includes ethylcellulose as an additive is applied as the abovementioned metal ink.
Inventors:
KOSHIJI KENJIRO (JP)
MAKITA YUICHI (JP)
NAKAMURA NORIAKI (JP)
KASUGA MASATO (JP)
OHSHIMA YUUSUKE (JP)
SATO HIROKI (JP)
OOTAKE SHIGEYUKI (JP)
KUBO HITOSHI (JP)
MAKITA YUICHI (JP)
NAKAMURA NORIAKI (JP)
KASUGA MASATO (JP)
OHSHIMA YUUSUKE (JP)
SATO HIROKI (JP)
OOTAKE SHIGEYUKI (JP)
KUBO HITOSHI (JP)
Application Number:
PCT/JP2020/024012
Publication Date:
December 24, 2020
Filing Date:
June 18, 2020
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
B05D3/10; B05D7/24; B32B15/02; B32B15/082; C09C1/62; C09C3/08; C09D11/03; C09D11/033; C09D11/08; H01B13/00; H05K3/10; H05K3/12
Domestic Patent References:
| WO2019031324A1 | 2019-02-14 | |||
| WO2017033911A1 | 2017-03-02 |
Foreign References:
| JP2016048601A | 2016-04-07 | |||
| JP2017034236A | 2017-02-09 | |||
| JP2012221587A | 2012-11-12 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
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