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Title:
METHOD OF FORMING MULTI−LAYER FILM
Document Type and Number:
WIPO Patent Application WO/2003/012887
Kind Code:
A1
Abstract:
A method of forming a multi−layer film comprising the steps of forming a diffusion prevention film on a substrate surface, migration−electrodepositing or electrodepositing a high−temperature superconductor and&sol or a high−temperature superconductor precursor, and heat treating the substrate to sinter the high−temperature superconductor and&sol or the high−temperature superconductor precursor and thereby form a superconducting film.

Inventors:
KAWACHI MASAHARU (JP)
YOSHIZAWA MASAHITO (JP)
Application Number:
PCT/JP2002/006806
Publication Date:
February 13, 2003
Filing Date:
July 04, 2002
Export Citation:
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Assignee:
JAPAN SCIENCE & TECH CORP (JP)
KAWACHI MASAHARU (JP)
YOSHIZAWA MASAHITO (JP)
International Classes:
C23C24/08; C23C26/00; C23C28/00; H01B13/00; H01L39/24; (IPC1-7): H01L39/24; C23C28/00; H01B13/00
Domestic Patent References:
WO1999007004A11999-02-11
Foreign References:
EP0631333A11994-12-28
JPH01247600A1989-10-03
Other References:
CHU C.T. ET AL.: "Fabrication of YBa2Cu2O7-gamma superconducting coatings by electrophoretic deposition", APPL. PHYS. LETT., vol. 55, no. 5, 31 July 1989 (1989-07-31), pages 492 - 494, XP000080841
Attorney, Agent or Firm:
Suzuye, Takehiko (7-2 Kasumigaseki 3-chom, Chiyoda-ku Tokyo, JP)
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