Title:
METHOD FOR FORMING PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/114382
Kind Code:
A1
Abstract:
A method for forming a pattern is disclosed which comprises a step wherein a fluid film is made from a material with fluidity, a step wherein a pressing surface of a pressing member which has at least one of a projected portion and a recessed portion is pressed against the fluid film so that the shape of at least one of the projected portion and the recessed portion is transferred onto the fluid film, a step wherein the fluid film is heated to a first temperature while pressing the pressing surface against the fluid film, so that the fluid film on which the shape of at least one of the projected portion and the recessed portion is transferred is solidified into a solid film, and a step wherein the solid film is heated to a second temperature which is higher than the first temperature, so that the solid film is fired, thereby forming a pattern composed of the fired solid film.
Inventors:
NAKAGAWA HIDEO
SASAGO MASARU
HIRAI YOSHIHIKO
SASAGO MASARU
HIRAI YOSHIHIKO
Application Number:
PCT/JP2004/008656
Publication Date:
December 29, 2004
Filing Date:
June 14, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
NAKAGAWA HIDEO
SASAGO MASARU
HIRAI YOSHIHIKO
NAKAGAWA HIDEO
SASAGO MASARU
HIRAI YOSHIHIKO
International Classes:
G03C5/00; G03F7/00; G03F9/00; H01L21/027; H01L21/302; H01L21/31; H01L21/312; H01L21/316; H01L21/44; H01L21/461; H01L21/469; H01L21/768; (IPC1-7): H01L21/027; H01L21/768; H01L21/312; H01L21/316
Foreign References:
| JP2001252927A | 2001-09-18 | |||
| JP2002158221A | 2002-05-31 | |||
| JP2003077807A | 2003-03-14 | |||
| JPH06267943A | 1994-09-22 | |||
| JPH07121914A | 1995-05-12 |
Attorney, Agent or Firm:
Maeda, Hiroshi (5-7 Hommachi 2-chome, Chuo-k, Osaka-shi Osaka 53, JP)
Download PDF: