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Patent Searching and Data


Title:
METHOD OF FORMING PATTERN
Document Type and Number:
WIPO Patent Application WO/2000/026726
Kind Code:
A1
Abstract:
A method of forming a pattern comprising: (1) depositing an energy-sensitive layer on the surface of a resin layer for formation of an insulating film, (2) emitting an active energy beam or heat wave directly or through a mask to obtain a desired pattern, (3) developing the energy-sensitive layer to form a resist pattern of the energy-sensitive layer, and (4) removing the resin layer by a further development process to obtain the desired pattern.

Inventors:
IMAI GENJI (JP)
OONISHI KENGO (JP)
HONMA HIROYUKI (JP)
KOGURE HIDEO (JP)
Application Number:
PCT/JP1999/006116
Publication Date:
May 11, 2000
Filing Date:
November 02, 1999
Export Citation:
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Assignee:
KANSAI PAINT CO LTD (JP)
IMAI GENJI (JP)
ONISHI KENGO (JP)
HONMA HIROYUKI (JP)
KOGURE HIDEO (JP)
International Classes:
G03F7/00; G03F7/004; G03F7/09; G03F7/40; H05K3/00; H05K3/28; G03F7/30; H05K1/03; (IPC1-7): G03F7/11; G03F7/30; G03F7/004; G03F7/42; G02B5/20; G02B5/00
Foreign References:
JPS4741374A
JPH01260831A1989-10-18
JPH04147631A1992-05-21
JPH06132208A1994-05-13
JPH0677159A1994-03-18
JPH08279488A1996-10-22
JPH06242603A1994-09-02
JPH10207046A1998-08-07
Attorney, Agent or Firm:
Katagiri, Mitsuji (Akasaka 4-chome Minato-ku Tokyo, Akasaka 4-chome Minato-ku Tokyo, JP)
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