Title:
METHOD FOR FORMING PATTERN
Document Type and Number:
WIPO Patent Application WO/2014/050560
Kind Code:
A8
Abstract:
Provided are: a device and method for reducing sagging of a pattern side wall part occurring when printing a wiring or electrode pattern using a screen printing method involving a conductive paste, an insulating paste, or a semiconductor paste; reducing mesh marks on the wiring or electrode pattern or on a full surface mat film; and manufacturing high-quality electronic components; and a pattern forming method in which screen printing can be used, the pattern forming method allowing double-sided printing to be conducted with fewer steps than a conventional method. A screen printing method is used to print, with the use of a conductive paste, an insulating paste, or a semiconductor paste, a pattern on a blanket having a surface comprising polydimethylsiloxane. The pattern is formed by being transferred from the blanket onto an object to be printed upon.
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Inventors:
NOMURA KENICHI (JP)
USHIJIMA HIROBUMI (JP)
IWASE NORIKO (JP)
YOSHIDA MANABU (JP)
USHIJIMA HIROBUMI (JP)
IWASE NORIKO (JP)
YOSHIDA MANABU (JP)
Application Number:
PCT/JP2013/074551
Publication Date:
March 26, 2015
Filing Date:
September 11, 2013
Export Citation:
Assignee:
NAT INST OF ADVANCED IND SCIEN (JP)
International Classes:
H01B13/00; H01G4/12; H01G4/30; H01G13/00; H05K3/20; C09D11/00
Attorney, Agent or Firm:
HONDA Ichiro (6th Floor Yusei Fukushi Kotohira Bldg., 14-1, Toranomon 1-chome, Minato-k, Tokyo 01, JP)
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