METHOD FOR FORMING PLATING - OMRON TATEISI ELECTRONICS CO

Title:

METHOD FOR FORMING PLATING

Document Type and Number:

WIPO Patent Application WO/2018/168129

Kind Code:

A1

Abstract:

According to the present invention, plating is formed on one side of a negative electrode by: coating the one side of the negative electrode with a paste formed by mixing particles in a plating liquid; disposing, on one side of a positive electrode, a liquid holding member impregnated with the plating liquid; making the negative electrode and the positive electrode face each other; bringing the liquid holding member and the paste into contact with each other; and applying a voltage between the negative electrode and the positive electrode.

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Inventors:

SAKAMOTO ICHIZO (JP)
SUZUKI MASAFUMI (JP)
FUJIOKA YUHEI (JP)

Application Number:

PCT/JP2017/044723

Publication Date:

September 20, 2018

Filing Date:

December 13, 2017

Export Citation:

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Assignee:

OMRON TATEISI ELECTRONICS CO (JP)

International Classes:

C25D15/02; C25D5/02; C25D17/00

Foreign References:

JPH04157197A	1992-05-29
JPS53137078A	1978-11-30
JPH01234590A	1989-09-19
JPS63277785A	1988-11-15