Title:
METHOD OF FORMING SCRIBE LINE ON SUBSTRATE OF BRITTLE MATERIAL AND SCRIBE LINE FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/049668
Kind Code:
A1
Abstract:
A method of forming a scribe line, and apparatus therefor, realizing division
of a substrate of brittle material with high straightness along a scribe line.
The surface of brittle material substrate is heated at a temperature lower than
the softening point of the brittle material substrate along a line destined for
scribe line formation by the use of laser beams, and immediately after the heating,
the heated region is cooled to thereby produce a first crack. Thereafter, along
the scribe line, a cutter is traveled in pressurized contact on the substrate
surface to thereby form a crack deeper than the first crack in the substrate.
Inventors:
SOYAMA, Masanobu (LTD. 2-12-12 Minami-Kanede, Suita-city Osaka 44, 5640044, JP)
Application Number:
JP2006/321324
Publication Date:
May 03, 2007
Filing Date:
October 26, 2006
Export Citation:
Assignee:
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (2-12-12, Minami-Kaneden Suita-cit, Osaka 44, 5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 5640044, JP)
International Classes:
B28D5/00; C03B33/02; C03B33/027; C03B33/09; C30B29/06; C30B33/00; H01L21/301
Attorney, Agent or Firm:
KASHIMA, Yoshio (409 Yuni Higashi-Umeda, 7-2 Minami Ogi-machi, Kita-k, Osaka-city Osaka 52, 5300052, JP)
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