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Patent Searching and Data


Title:
METHOD FOR FORMING SEALING FILM, AND SEALING FILM
Document Type and Number:
WIPO Patent Application WO/2016/076119
Kind Code:
A1
Abstract:
Provided is a method for forming a sealing film, which is capable of stably forming a sealing film having high barrier properties. Specifically provided is a method for forming a sealing film by alternately forming, on a base 2, buffer layers M1 and a barrier layer M2 that has a higher density than the buffer layers M1, and this method comprises a first buffer layer formation step wherein a first buffer layer M1a is formed on the surface of the base 2, a first barrier layer formation step wherein a barrier layer M2 is formed on the surface of the first buffer layer M1, and a second buffer layer formation step wherein a second buffer layer M1b is formed on the surface of the barrier layer M2 that has been formed in the first barrier layer formation step. The ratio of the film thickness of a portion of the first buffer layer M1a formed in the direction inclined to the thickness direction of the base 2 to the film thickness of another portion of the first buffer layer M1a formed in the thickness direction of the base 2 is closer to 1 than the ratio of the film thickness of a portion of the second buffer layer M1b formed in the direction inclined to the thickness direction to the film thickness of another portion of the second buffer layer M1b formed in the thickness direction.

Inventors:
YAMASHITA MASAMICHI (JP)
FUJIMOTO TAKAYOSHI (JP)
MORI MASAKI (JP)
Application Number:
PCT/JP2015/080475
Publication Date:
May 19, 2016
Filing Date:
October 29, 2015
Export Citation:
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Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B32B7/02; C23C16/505; H01L21/316; H01L31/048
Foreign References:
JPH05335299A1993-12-17
JPH07130731A1995-05-19
JP2010180434A2010-08-19
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