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Patent Searching and Data


Title:
METHOD FOR FORMING SHORT CIRCUIT IN WIRE HARNESS
Document Type and Number:
WIPO Patent Application WO/2012/114732
Kind Code:
A1
Abstract:
Provided is method with which it is easy to form a water-proof short circuit in a wire harness containing a plurality of electric cables gathered together in a bundle. This method contains: a step of short-circuiting by connecting the ends of a plurality of specific electric cables (10) with a shared joint connector (JC); and a step of forming a water-proof body (50) and sealing the joint connector (JC) within this water-proof body (50), thereby water-proofing the joint connector (JC). The step of forming a water-proof body (50) comprises: a step of laminating a first sheet body (52A), the joint connector (JC) and the end part (10a) of each electric cable (10) connected thereto, with a second sheet body (52B); and a step in which by sucking air from the first sheet body (52A) side in that laminated state, the peripheral part (52b) of the second sheet body (52B) and the peripheral part (52a) of the first sheet body (52A) are adhered to one another, and the sheet bodies (52A and 52B) are adhered to the surfaces of the end parts (10a) of the electric cables (10).

Inventors:
NISHIO AKIHIRO (JP)
HIRAI HIROKI (JP)
MATSUMOTO KOUICHI (JP)
SHIMODA HIROKI (JP)
OMORI YASUO (JP)
DONG XUEQING (JP)
Application Number:
PCT/JP2012/001186
Publication Date:
August 30, 2012
Filing Date:
February 22, 2012
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
NISHIO AKIHIRO (JP)
HIRAI HIROKI (JP)
MATSUMOTO KOUICHI (JP)
SHIMODA HIROKI (JP)
OMORI YASUO (JP)
DONG XUEQING (JP)
International Classes:
H01B13/012; H01B13/00; H01B13/32; H01R31/08; H01R43/01
Foreign References:
JPH09102332A1997-04-15
JP2010177037A2010-08-12
JPS63157163U1988-10-14
JPH11111065A1999-04-23
JPH02212125A1990-08-23
JP2009207299A2009-09-10
JP2011165376A2011-08-25
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Download PDF:
Claims: