Title:
METHOD FOR FORMING SURFACE ACOUSTIC WAVE RESONANCE DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/012311
Kind Code:
A1
Abstract:
A method for forming a surface acoustic wave resonance device, relating to the technical field of semiconductors. The method comprises: providing a piezoelectric substrate, the piezoelectric substrate comprising a first interval area, a first area, a second area, a third area, and a second interval area which are sequentially arranged in a first direction; forming an electrode layer on the surface of the piezoelectric substrate, the electrode layer comprising: a first bus, a second bus, a plurality of first electrode strips connected to the first bus, and a plurality of second electrode strips connected to the second bus; forming a first temperature compensation layer on the surface of the piezoelectric substrate and the surface of the electrode layer, the first temperature compensation layer comprising a first compensation area and a second compensation area, and the surface of the first temperature compensation layer in the first compensation area being higher than the surface of that in the second compensation area; and forming, on the surface of the first temperature compensation layer, a first load layer located on the first area and a second load layer located on the third area. Therefore, the existing forming processes are improved.
Inventors:
HAN XING (CN)
ZHOU JIAN (CN)
ZOU YALI (CN)
WANG BIN (CN)
ZHOU JIAN (CN)
ZOU YALI (CN)
WANG BIN (CN)
Application Number:
PCT/CN2023/105658
Publication Date:
January 18, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
CHANGZHOU CHEMSEMI CO LTD (CN)
International Classes:
H03H3/08; H03H3/10; H03H9/02; H03H9/25
Foreign References:
| CN114884480A | 2022-08-09 | |||
| CN113839648A | 2021-12-24 | |||
| CN112653415A | 2021-04-13 | |||
| CN113162580A | 2021-07-23 | |||
| JP2004023593A | 2004-01-22 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW CO., LTD. (CN)
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