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Title:
METHOD OF FORMING THICK FILM OF OXIDE SUPERCONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2007/069723
Kind Code:
A1
Abstract:
A method of forming a thick film of oxide superconductor, in which with respect to a Bi2223 thick film formed on a treatment object, without lowering of Jc, the adherence to the treatment object is increased so as to attain an enlargement of the sectional area of the Bi2223 thick film. A mixture of Pb and composite oxide with Bi2212 formulation is applied to a surface of treatment object, and fired to thereby form a first thick film. On this first thick film, there is formed a thick film of oxide superconductor represented by the general formula: (Bi,Pb)2+aSr2Ca2Cu3O2 (provided that -0.1≤a≤0.5).

Inventors:
KOJIMA, Masahiro (C/O DOWA ELECTRONICS MATERIALS CO, LTD. 14-1 Sotokanda 4-chome, Chiyoda-k, Tokyo 21, 1010021, JP)
小嶋 正大 (〒21 東京都千代田区外神田四丁目14番1号 DOWAエレクトロニクス株式会社内 Tokyo, 1010021, JP)
KAWAHARA, Masakazu (C/O DOWA TECHNOLOGY CO, LTD. 14-1 Sotokanda 4-chome, Chiyoda-k, Tokyo 21, 1010021, JP)
川原 正和 (〒21 東京都千代田区外神田四丁目14番1号 DOWAテクノロジー株式会社内 Tokyo, 1010021, JP)
Application Number:
JP2006/325044
Publication Date:
June 21, 2007
Filing Date:
December 15, 2006
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO., LTD. (14-1, Sotokanda 4-chome Chiyoda-ku, Tokyo 21, 1010021, JP)
DOWA エレクトロニクス 株式会社 (〒21 東京都千代田区外神田四丁目14番1号 Tokyo, 1010021, JP)
CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY (6-1 Ohtemachi 1-chome, Chiyoda-ku Tokyo, 26, 1008126, JP)
財団法人電力中央研究所 (〒26 東京都千代田区大手町1丁目6番1号 Tokyo, 1008126, JP)
KOJIMA, Masahiro (C/O DOWA ELECTRONICS MATERIALS CO, LTD. 14-1 Sotokanda 4-chome, Chiyoda-k, Tokyo 21, 1010021, JP)
小嶋 正大 (〒21 東京都千代田区外神田四丁目14番1号 DOWAエレクトロニクス株式会社内 Tokyo, 1010021, JP)
International Classes:
C01G29/00; C01G1/00; H01B12/06; H01B13/00; C01G29/00; C01G1/00; H01B12/06; H01B13/00
Attorney, Agent or Firm:
ANIYA, Setuo et al. (21 TOWA BLDG. 3F, 4-6-1 Iidabashi, Chiyoda-k, Tokyo 72, 1020072, JP)
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