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Patent Searching and Data


Title:
METHOD FOR FORMING THIN FILM ON BASIC MATERIAL THROUGH INTERMEDIATE LAYER
Document Type and Number:
WIPO Patent Application WO/2004/040046
Kind Code:
A1
Abstract:
A technology for forming a thin film of good quality on a basic material through an intermediate layer. The technology is applied preferably to the formation of a high-temperature superconducting oxide thin film being employed in a superconducting wire material or a superconducting device. The method for forming a thin film on a basic material through an intermediate layer is characterized by comprising a process for calculating the energy Ea on the interface A between the basic material and the intermediate layer, the energy Eb on the interface B between the intermediate layer and the thin film, and the energy Ec on the interface C between the basic material and the thin film under a state where the intermediate layer does not exist, and a process for selecting an intermediate layer material satisfying the conditions Ea

Inventors:
HASEGAWA KATSUYA (JP)
IZUMI TERUO (JP)
SHIOHARA YUH (JP)
SUGAWARA YOSHIHIRO (JP)
HIRAYAMA TSUKASA (JP)
OBA FUMIYASU (JP)
IKUHARA YUICHI (JP)
Application Number:
PCT/JP2003/013887
Publication Date:
May 13, 2004
Filing Date:
October 29, 2003
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
INT SUPERCONDUCTIVITY TECH (JP)
HASEGAWA KATSUYA (JP)
IZUMI TERUO (JP)
SHIOHARA YUH (JP)
SUGAWARA YOSHIHIRO (JP)
HIRAYAMA TSUKASA (JP)
OBA FUMIYASU (JP)
IKUHARA YUICHI (JP)
International Classes:
C30B23/02; C30B25/18; H01L39/24; C30B29/22; (IPC1-7): C30B29/22; H01L39/24
Foreign References:
US5607899A1997-03-04
Other References:
KATSUYA HASEGAWA ET AL: "Laser Jochakuho ni yoru SmBa2Cu3Oy Maku no Sakusei to sono Men'nai Haikosei Kojo", NIPPON KINZOKU GAKKAISHI, vol. 66, no. 4, 20 April 2002 (2002-04-20), pages 320 - 328, XP002974838
See also references of EP 1557485A4
Attorney, Agent or Firm:
Fukami, Hisao (Mitsui Sumitomo Bank Minamimorimachi Bldg. 1-29, Minamimorimachi 2-chome, Kita-k, Osaka-shi Osaka, JP)
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