Title:
METHOD FOR FORMING THROUGH VIA METAL WIRING
Document Type and Number:
WIPO Patent Application WO/2024/049135
Kind Code:
A1
Abstract:
The present invention pertains to a method for forming through via metal wiring. According to the method of the present invention, through via metal wiring can be formed to have excellent plating quality without an expensive sputtering process by bonding metal foil to one surface of a substrate on which a through via is formed, and using the metal foil as a metal seed layer.
Inventors:
KIM SUNG WOONG (KR)
HUR WOOK HWAN (KR)
KIM NAM-JIN (KR)
NA YONG-CHAE (KR)
HUR WOOK HWAN (KR)
KIM NAM-JIN (KR)
NA YONG-CHAE (KR)
Application Number:
PCT/KR2023/012713
Publication Date:
March 07, 2024
Filing Date:
August 28, 2023
Export Citation:
Assignee:
EXTOL CO LTD (KR)
International Classes:
H01L21/48; H01L23/00; H01L23/498
Foreign References:
| JP2016213283A | 2016-12-15 | |||
| KR20180036805A | 2018-04-09 | |||
| JP2006140216A | 2006-06-01 | |||
| KR20180122462A | 2018-11-12 | |||
| KR20190003050A | 2019-01-09 |
Attorney, Agent or Firm:
YU, Su Mi (KR)
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