Title:
METHOD FOR IMPARTING ELECTRICAL CONDUCTIVITY TO SILICONE RESIN, AND SILICONE RESIN PROVIDED WITH METALLIC COATING FILM
Document Type and Number:
WIPO Patent Application WO/2014/017291
Kind Code:
A1
Abstract:
A method for imparting electrical conductivity to a silicone resin, said method comprising: a substrate-constructing step for polymerizing an unsaturated bond-containing organopolysiloxane to construct a substrate formed of a silicone resin; a UV treatment step for irradiating the substrate with ultraviolet light, or an ozone step for contacting the substrate with ozone water; a catalyst step for adding an electroless plating catalyst to the substrate; and an electrical conductivity-imparting step for forming an electroless plating film.
Inventors:
NISHIWAKI TAIJI (JP)
UMEDA YASUSHI (JP)
TASHIRO KATSUHIKO (JP)
YOSHINO MASAHIRO (JP)
HONMA HIDEO (JP)
UMEDA YASUSHI (JP)
TASHIRO KATSUHIKO (JP)
YOSHINO MASAHIRO (JP)
HONMA HIDEO (JP)
Application Number:
PCT/JP2013/068747
Publication Date:
January 30, 2014
Filing Date:
July 09, 2013
Export Citation:
Assignee:
KANTO GAKUIN SCHOOL CORP (JP)
International Classes:
C23C18/20; C23C18/30; C23C18/36
Foreign References:
| JP2005042029A | 2005-02-17 | |||
| JP2003027250A | 2003-01-29 | |||
| JP2002309377A | 2002-10-23 |
Attorney, Agent or Firm:
ITOH SUSUMU (JP)
Susumu Ito (JP)
Susumu Ito (JP)
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